Stacked package structure of image sensor

ABSTRACT

A stacked package structure of an image sensor for electrically connecting to a printed circuit board includes a first substrate, a second substrate, an integrated circuit, an image sensing chip, and a transparent layer. The second substrate is mounted on the first substrate so as to a cavity formed between the first substrate and second substrate. The integrated circuit is located within the cavity and electrically connected the first substrate. The image-sensing chip is arranged on the second substrate. The transparent layer covers over the image sensing chip, wherein the image sensing chip receives image signals via the transparent layer and transforms the image signals into electrical signals transmitted to the first substrate.  
     Thus, the image sensing chip of the image sensing product and the integrated circuit can be integrally package.

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention relates to a stacked package structure ofan image sensor, in particular, to a structure in which integratedcircuit and image sensing chip, both having different function, arepackaged into a package body so as to reduce the number of the packagesubstrates and to integrally package the integrated circuited and imagesensing chip both having different functions.

[0003] 2. Description of the Art

[0004] A general sensor is used for sensing signals, which may beoptical or audio signals. The sensor of the present invention is usedfor receiving images and transforming the image signals into electricalsignal to be transmitted to a printed circuit board.

[0005] A general sensor is used for receiving image signals andconverting the image signals into electrical signals that aretransmitted to a printed circuit board. The image sensor is thenelectrically connected to other integrated circuit to have any requiredfunctions. For example, the image sensor may be electrically connectedto a digital signal processor that processes the signals generated fromthe image sensor. Further, the image sensor may also be electricallyconnected to a micro controller, a central processor, or the like, so asto have any required function.

[0006] However, since the conventional image sensor is packaged, theintegrated circuits corresponding to the image sensor have to beindividually packaged with the image sensor. Then, the packaged imagesensor and various signal processing units are electrically connectedonto the printed circuit board.

[0007] Thereafter, the image sensor is electrically connected to thesignal processing units by a plurality of wirings, respectively,therefore, in order to individually package each of the signalprocessing units and the image sensor, a plurality of substrates andpackage bodied have to be used, thereby increasing the manufacturingcosts. Furthermore, the required area of the printed circuit boardshould be large when mounting each of the processing units onto theprinted circuit board, so the products cannot be made small, thin, andlight.

[0008] In order to solve the above-mention problems, the presentinvention provides a stacked structure of an image sensor to overcomethe disadvantages caused by conventional sensor.

SUMMARY OF THE PRESENT INVENTION

[0009] It is therefore an object of the present invention to provide astacked package structure of an image sensor for reducing the number ofthe package elements and lowering the package costs.

[0010] It is therefore another object of the present invention toprovide a stacked package structure of an image sensor for simplifyingand facilitating the manufacturing processes.

[0011] It is therefor still object of the present invention to provide astacked package structure of an image sensor for lowering the area ofthe image sensor.

[0012] It is therefor yet object of the present invention to provide astacked package structure of an image sensor for lowering the packagecosts and testing costs of the image sensing products.

[0013] According to one aspect of the present invention, a stackedpackage structure of an image sensor for electrically connecting to aprinted circuit board comprises a first substrate, a second substrate,an integrated circuit, an image sensing chip, and a transparent layer.The first substrate has a first surface and a second surface opposite tothe first surface. The first surface of the first substrate being formedwith signal input terminals. The second surface of the first substratebeing formed with signal output terminals for electrically connecting tothe printed circuit board. The second substrate has a upper surface anda lower surface opposite to the upper surface. The lower surface of thesecond substrate is adhered to the first surface of the first substrate,so that a cavity is formed between the first substrate and secondsubstrate. The integrated circuit is mounted on the first surface of thefirst substrate and located within the cavity, and the integratedcircuits electrically connected to the signal input terminals on thefirst surface of the substrate. The image sensing chip is arranged onthe upper surface of the second substrate. The transparent layer coversover the image sensing chip, wherein the image sensing chip receivesimage signals via the transparent layer and transforms the image signalsinto electrical signals transmitted to the first substrate.

[0014] Thus, the image sensing chip of the image sensing product and theintegrated circuit can be integrally package.

BRIEF DESCRIPTION OF THE DRAWINGS

[0015]FIG. 1 is a schematic illustration showing a stacked packagestructure of an image sensor according to a first embodiment of thepresent invention.

[0016]FIG. 2 is a schematic illustration showing a stacked packagestructure of an image sensor according to a second embodiment of thepresent invention.

[0017]FIG. 3 is a schematic illustration showing a stacked packagestructure of an image sensor according to a third embodiment of thepresent invention.

[0018]FIG. 4 is a schematic illustration showing a stacked packagestructure of an image sensor according to a third embodiment of thepresent invention.

DETAIL DESCRIPTION OF THE PRESENT INVENTION

[0019] The embodiment of the present invention will now be describedreference to the drowning.

[0020] As shown in FIG. 1, the stacked package structure of an imagesensor of the present invention includes a first substrate 10, a secondsubstrate 22, an integrated circuit 30, an image sensing chip 34, aprojecting structure 38 and a transparent layer 40.

[0021] The first substrate 10 has a first surface 12 and a secondsurface 14 opposite to the first surface 12. The first surface 12 of thefirst substrate 10 is formed with signal input terminals 16. The secondsurface 14 of the first substrate 10 is formed with signal outputterminals 18, which may be metallic balls arranged in the form of ballgrid array, for transmitting signals from the first substrate 10 to theprinted circuit board 20.

[0022] The second substrate 22 has an upper surface24 and a lowersurface 26 opposite to the upper surface 24. The lower surface 26 of thesecond substrate 22 is adhered to the first surface 12 of the firstsubstrate 10, so that a cavity 28 is formed between the first substrate10 and second substrate 22.

[0023] The integrated circuit 30 may be a signals processing unit suchas a digital signal processor, a micro-processor, a central processingunit (CPU), or the like. Which is arranged on the first surface 12 ofthe first substrate 10 and is located within the cavity 28. Theintegrated circuit 30 is electrically connected to the signal inputterminals 16 formed on the first surface 12 of the first substrate 10via a plurality of wirings 32 by way of wire bond. So that theintegrated circuit 30 is electrically connected to the first substrate10. If the integrated circuit 30 is a digital signal processor, thesignals from the image sensing chip 34 can be processed in advance andthen transmitted to the printed circuit board 20.

[0024] The image sensing chip 34 is arranged on the upper surface 24 ofthe second substrate 22 and electrically connected to the signal inputterminals 16 formed on the first surface 12 of the first substrate 10.So as to a signals from the image sensing chip 34 can be transmitted tothe first substrate 10.

[0025] The projecting structure 38 is a frame mounted on the firstsurface 12 of the first substrate 10 for surrounding the integratedcircuit 30 and image sensing chip 34.

[0026] The transparent layer 40 may be a transparent glass, which iscovering the projecting structure 38 for sealing the integrated circuit30 and image sensing chip 34. The image sensing chip 34 is capable ofreceiving image signal via the transparent layer 40 and converting theimage signals into electrical signals that are to be transmitted to thefirst substrate 10.

[0027] Referring to FIG. 2 is a schematic illustration showing a stackedpackage structure of an image sensor according to a second embodiment ofthe present invention. The upper surface 24 of the second substrate 22is formed with signal input terminals 42. The lower surface 26 of thesecond substrate 22 is mounted to the first surface 12 of the firstsubstrate 10. Thus, a cavity 28 is formed between the first substrate 10and second substrate 22. The integrated circuit 30 is arranged on thefirst surface 12 and is located within the cavity 28. Then, theintegrated circuit 30 being electrically connected to the signal inputterminals 42 formed on the first surface 12 of the first substrate 10via wirings 32 by way of wire bond.

[0028] The image sensing chip 34 is arranged on the upper surface 24 ofthe substrate 22, which is electrically connected to the signal inputterminals 42 formed on the upper surface 24 of the second substrate 22.

[0029] The projecting structure 38 is mounted on the first surface 12 ofthe first substrate 10 for surrounding the integrated circuit 30 andimage sensing chip 34.

[0030] The transparent layer 40 may be a transparent glass, which islocated on the projecting structure 38 for sealing the integratedcircuit 30 and image sensing chip 34. The image sensing chip 34 iscapable of receiving image signals via the transparent layer 40 andconverting the image signals into electrical signals to be transmittedto the first substrate 10.

[0031] Referring to FIG.3, the transparent layer 40 may be a transparentglue, which is covered over the upper surface 24 of the second substrate22, therefore, the integrated circuit 30 and image sensing chip 34 aresealed by the transparent layer 40. Then, the image sensing chip 34 canreceive image signals via the transparent layer 40 and can transform theimage signals into electrical signals to be transmitted to the firstsubstrate 22.

[0032] Referring to FIG. 4, the transparent layer 40 is a “

shaped” transparent glue, which has supporting column 46 for mounting tothe upper surface 24 of the second substrate 22. The “

shaped” transparent layer 40 can be formed by injecting or pressmolding. Thus, the image sensing chip 34 and integrated circuit 30 arecovered by the transparent layer 40, a image signals can be received bythe image sensing chip 34 via the transparent 40.

[0033] The

shaped of the transparent layer 40 is made of thick, so as to thestacked package structure of the image sensor can supply a bettertransparent quality.

[0034] According to the above-mention structure, the followingadvantages can be obtained.

[0035] 1. Since the image sensing chip 34 and integrated circuit 30 canbe integrally package, the material forming the substrate 10 can bereduced, thereby lowering the manufacturing costs of the image sensingproducts.

[0036] 2. Since the image sensing chip 34 and integrated circuit 30 canbe integrally package, the area of the image sensing products can bereduced.

[0037] 3. Since the image sensing chip 34 and integrated circuit 30 canbe integrally package, there is only one package body. Thus, one testingfixture needs be used, and the testing costs can also be reduced.

[0038] 4. Since the image sensing chip 34 and integrated circuit 30 canbe integrally package, two chips can be package by only one packagingprocess. The package costs can thus effectively lowered.

[0039] While the present invention has been described by way of exampleand in terms of preferred embodiments, it is to be understood that thepresent invention is not limited to the disclosed embodiments.Therefore, the scope of the appended claims should be accorded thebroadest interpretation so as to encompass all such modifications.

What is claimed is:
 1. A stacked package structure of an image sensor isused for electrically connecting to the printed circuit board,comprising: a first substrate having a first surface and a secondsurface opposite to the first surface, the first surface being formedwith signal input terminals, then, the second surface being formed withsignal output terminals for electrically connecting to the printedcircuit board. a second substrate having a upper surface and a lowersurface opposite to the upper surface, the lower surface of the secondsubstrate being adhered to the first surface of the first substrate.Thus a cavity is formed between the first substrate and secondsubstrate. an integrated circuit mounted on the first surface of thefirst substrate and located within the cavity, and the integratedcircuit electrically connected to the signal input terminals on thefirst surface of the first substrate. an image sensing chip arranged onthe upper surface of the second substrate, and electrically connected tothe first substrate. a transparent layer covering over the image sensingchip, wherein the image sensing chip receives image signals via thetransparent layer and transforms the image signals into electricalsignals transmitted to the first substrate.
 2. The stacked packagestructure of an image sensor according to claim 1, wherein the signaloutput terminals on the second surface of the first substrate aremetallic balls arranged in the form of ball grid array for electricallyconnecting to the printed circuit board.
 3. The stacked packagestructure of an image sensor according to claim 1, wherein the uppersurface of second the substrate formed with signal input terminals. Theimage sensing chip is electrically connected the signal input terminalson the upper surface of the second substrate. Thus, the signals from theimage sensing chip can be transmitted from the second substrate to thefirst substrate.
 4. The stacked package structure of an image sensoraccording to claim 1, wherein the image sensing chip being electricallyconnected to the signal input terminals on the first surface ofsubstrate.
 5. The stacked package structure of an image sensor accordingto claim 1, wherein the integrated circuit is a signals processing unit.6. The stacked package structure of an image sensor according to claim5, wherein the signal processing unit is a digital signal processor forprocessing the signals from the image sensing chip.
 7. The stackedpackage structure of an image sensor according to claim 5, wherein thesignals processing unit is a micro-controller.
 8. The stacked packagestructure of an image sensor according to claim 5, wherein the signalsprocessing unit is a central processing unit (CPU).
 9. The stackedpackage structure of an image sensor according to claim 1, wherein thetransparent layer is a transparent glass.
 10. The stacked packagestructure of an image sensor according to claim 1, wherein a projectingstructure is arranged on the periphery of the upper surface of thesecond substrate, and the transparent layer is located on the projectingstructure.
 11. The stacked package structure of an image sensoraccording to claim 1, wherein the transparent layer is transparent glue.12. The stacked package structure of an image sensor according to claim10, wherein the transparent glue is “

-shaped” having a supporting column for mounting to the upper surface ofthe second substrate.